---
title: Fully Automatic Probing Systems
description: Innovative probing and inspection solutions
---

Fully Automatic 200 mm MEMS Wafer Probing System with a Dual End-effector to Handle Wafers, Frames, and Trays of Die

Fully Automated MEMS Vacuum Wafer Probe System with Black Bodies to Test 150 mm and 200 mm Wafers

Fully Automated 150 mm MEMS Vacuum Probing System to Test Wafers Using a Probe Card & Individual Manipulators

Fully Automated Vacuum MEMS Probing System to Test 150 mm and 200 mm Wafers in Carriers using Programmable Manipulators and Probe Cards

Fully Automated Optoelectronic Probing System for Testing 150 mm and 200 mm Silicon Photonic Wafers using DC, High-Frequency and Hexapod Manipulators

PS4L Fully Automatic 300 mm Double-Sided Probing System for Testing Silicon Photonic Wafers at Hot and Cold Temperatures in a Shielded Environment using a Probe Card

Fully Automatic 300 mm Probing System for Device Characterization using Programmable Manipulators and Probe Cards in a Dark and Environmentally Controlled Enclosure

PS4L Fully Automatic 200 mm High-Power Probing System Using Manipulators & Probe Cards Up to 3 KV

# Fully Automatic Probing Systems

SemiProbe manufactures a family of Fully Automatic Probing Systems - single, double-sided, chambered and vacuum using our patented Probe System for Life (PS4L) probing platform. With SemiProbe PS4L probe systems the customer has the option of initially purchasing a Fully Automatic (FA) probe system configured for the application or to field upgrade their existing PS4L Semiautomatic (SA) probe system to a Fully Automatic system. The primary difference between the systems is the FA system includes the automation module. The typical automation module includes a material handling system, an end-effector, a pre-aligner, a chuck lift pin kit, two (2) cassettes, software, and a safety enclosure. Numerous accessories such as thermal chucks, bar code or OCR readers, black bodies, motion analyzers, laser systems, extra cassettes, manipulators, probe card holders, enclosures and more can be added initially or as a field upgrade. The customer has the option of testing a variety of devices automatically – wafers (50 mm to 300 mm – standard, thinned, transparent), wafers mounted on frames, substrates, trays of die and more. All our Fully Automatic probe systems can be configured as single or multi-purpose probing solutions that can be operated in a 24/7 probing environment. The customer has the option of operating our Fully Automatic probe systems in manual, semiautomatic and fully automatic modes.

#### [**Click Here to Learn More About Automated Systems Applications**](https://semiprobe.com/hubfs/Applications%20Sheets/2023Automation%20Systems%20Overview%20WAT%20FV.pdf?hsLang=en)

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