Double-Sided Probing Systems
Most conventional probe systems are designed to probe their device from the topside down. The manipulators or the probe card contacts the device under test (DUT) affixed to a solid chuck and below the probes.
There are a number of integrated circuits, MEMS, Optoelectronics, Silicon Photonics, and thru silicon via (TSV) devices that require different probing methods to allow their devices to be stimulated in a few different ways – top stimulation (bias) with a backside output, bottom stimulation with a topside output or simultaneously from the top and bottom sides.
SemiProbe provides a family of manual, semiautomatic, and fully automatic double-sided probing systems (DSP). DSP probe systems are unique and require several customized accessories to meet the customer's application. To provide probing or access from both sides of the device customized device fixturing to hold die, partial wafers, and whole wafers (50 mm to 300 mm) are required. Upward and downward-looking optics are often used for fiber or detector placement or probe alignment and contact from both sides of the device. Individual manipulators (manual or programable) with a variety of probe arms (DC, High Frequency, OPTO and more) as well as probe cards (one or both sides) are used to contact the DUT. Fibers, detectors and integrating spheres are often moved in and out of position using manual or programmable stages. Several different types of instruments, mirrors, filters and more can be mounted on either side. DSP probe systems are available with thermal capabilities (hot and cold) and DUT temperature can be monitored using a few different methods.