Failure Analysis
Failure Analysis (FA) plays a crucial role in the production of semiconductors. Failures can occur in process, test, and in the field. It is critical to determine the root cause of failures and to provide timely feedback in order to fix the problem. There are several FA methods that use probe systems to perform destructive and non-destructive electrical tests to identify the location and nature of the defect. SemiProbe's patented Probe System for Life ® (PS4L) probing platform is ideally suited to excel in this application.
All key components are interchangeable, making it modular, customizable, and easy to switch between individual die, wafers, and packaged parts. Topside and Bottom Side probing solutions at ambient and or over temperature are available. SemiProbe has developed unique thermal stages, packaged part holders, manipulators, and OEM integrations to facilitate FA testing. Our optics, CCTV systems and frame grabbers facilitate thorough and rapid documentation. Our manual and programmable manipulators are configured with a family of interchangeable probe arms - coaxial, triaxial, kelvin, HF, OPTO, High Power and more to contact anything from bond pads to sub-micron features. PS4L FA probing systems are available as stand-alone or integrated solutions with OEM partners to provide stable, reliable, and modular probing systems.
